Sputtering System for Thin Film Deposition

Tool
AJAATC 2200-V

Applications
Deposition of thin films and multilayers of a wide range of metals and alloys.

Technical Specifications
Stainless steel main deposition chamber 22" diameter. AJA International six tilted A320-XP UHV magnetron sputtering source(s) use 2" diameter targets. Four Source(s) configured for magnetic material sputtering. Confocal sputtering forhigh deposition uniformity when depositing onto a rotating substrate holder with adjustable working distance. Quartz crystal thickness monitor, +/-2% thickness uniformity on 4 inch wafers. Phase II-J computer controlsoftware(Labview based). Three (3) DC 750 watt generators.One RF 300 Watt generator, with auto-matching network. One RF 100 Watt generator, manual matching network for substrate biasing.Substrates up to 4" diameter.Continuous rotation (0-20RPM).Radiant heating to 850 0C with quartz halogen lamps.Load-Lock with a low volume aluminium chamber for 4" substrate carriers. -Manual isolation gate valve between load-lock and main chamber. Magnetic transfer arm, for transferable substrate carrier.

Researcher in charge:Eamonn Devlin