Sputtering System for Thin Film Deposition

Tool
Cooke CVE 401

Applications
Deposition of thin films and multilayers of a wide range of metals and alloys.

TechnicalSpecifications
Main Deposition chamber 15" diameter from stainless steel. Computer controlled vacuum pumping consisting of: 450 l/s Leybold turbopump and Leybold scrollvac. Three AJA International stiletto UHV magnetron sputtering source(s) use 2" diameter targets, configured for magnetic material sputtering. Two (2) Advanced-Energy DC 500 watt generators.One (1) Advanced energy 300 Watt RF generator, with auto-matching network. Substrate Holder, accommodates substrates up to 4" diameter, mounts to top of chamber for sputter up orientation. Substrate heating up to 700 0C with homemade heater.

Researcher in charge: A. Speliotis