ebME / e-beam Metal Evaporation

Tool
DENTON / DV-602

Applications
Production of high-purity uniform Alcoatings on solid or flexible substrates.EBME is a non-conformal deposition technique and thereby, it is ideal for lift-off processing compared to other techniques (magnetron sputtering, ALD, etc.). EBME is used for a wide range of applications ranging from electrical contactstointerconnect lines in micro/nanoelectronics and optoelectronics.

Technical Specifications

•Methode
e-Gun MetalEvaporation

•Coatings
Al

•Process Parameters
Metals: Al
Substrates: Semiconductors, dielectrics, polymers
Resistance Evaporation Source: 2kVA, capable of 400A (at 5V) or 200A (at 10V)
Deposition rate: from 100 to 360 nm/min

•Sample dimensions
From small samples of 1cm x 1cm to 4 ́ ́wafers. Multi-wafer (up to six 4 ́ ́or six 3 ́ ́wafers) holder

•Operating environmentClean-room ISO 6 (Class 1000)

Dr. Vassilis Vamvakas (v.vamvakas@inn.demokritos.gr)