ADS / Automatic Dicing Saw

ToolDISCO DAD 321

Applications
Cutting of processed / unprocessed semiconductor, glass or ceramic substrates into individual units (dies). The substrate is typically mounted on a metal frame with a sticky tape. Different factors like substrate size, thickness and material, cutting streets determine the dicing parameters including blade selection. DI water is dispensed along the blade trajectory to wash away particles and provide lubrication and cooling.

Technical Specifications
•Cutting Rotating diamond bladesin a wet environment
•Kerf widthFrom 0.035 to 0.4mm depending on substrate materials and thickness
•Cutting depth: Up to 3 mm
•Cutting speed:1 –100 mm/s
•Spindle speed30.000 rpm
•Position accuracy:< 8 μm (accumulated from 10 line cuts on 4 ́ ́wafer)
•Substrate SizeUp to 6” in diameter