RF MS / RF Magnetron Sputtering

Tool
Custom made RF Magnetron Sputtering apparatus

Applications
Production of uniform thin and ultra-thin films on solid or flexible substrates. Metals, semiconductors and dielectrics can be deposited through RF sputtering. The technique is conformal and is therefore ideal for covering both flat and 3D structures. The applications of RF sputtering cover a widerange of topics including metallic interconnects, magnetic materials, thin film semiconductors and dielectrics for microelectronics, optoelectronics and sensor systems

Technical Specifications

•Available materialsa-Si, Ge, SiO2, SiO, Al2O3, ITO, Ti, Pd, Al, Cu, Ag.3inch targets are used as the material sources
Addition of extra materials possible

•Deposition ratesFrom 0.5 to 10Å/s

•SubstratesSemiconductors, dielectrics, metals, organic materials

•Sample dimensionsUp to 3inch wafers

•Deposition atmosphere / temperatureAr / Room temperature

•Operating environment Standard room

Dr. Emmanouel Hourdakis (m.hourdakis@inn.demokritos.gr)

Dr. Christos Tsamis (c.tsamis@inn.demokritos.gr)