Thin film characterization/Electrical-Magnetic Measurements

Tool
Thin Film Analyzer Linseis

Applications
Van-der-Pauw measurement, Seebeck-Coefficient measurement, Thin film thermal conductivity measurement.

Technical Specifications
Measurement principle: Chip based (pre-structured measurement chips)
Temperature range: RT up to 280°C
Sample thickness: From 5 nm to 25 μm (range depends onsample)
Measured parameters: Thermal Conductivity (3 Omega), Specific Heat, Electrical Conductivity / Resistivity, Seebeck Coefficient, Hall Constant / Mobility / Charge carrier conc.
Permanent magnet up to 0.5 T
Vacuum: up to 10-5mbar
Electronics: Integrated
Interface: USB

Measurement range
Thermal Conductivity: 0.05 up to 200 W/m∙K
Electrical Resistivity: 0.05 up to 1∙106 S/cm
Seebeck Coefficient: 5 up to 2500 μV/K

Analysis Software: Microsoft Windows based LINSEIS thermal analysis software

Dr. Thomas Stergiopoulos t.stergiopoulos@inn.demokritos.gr